Amaoe Universal Stencil BGA IC Reballing Stencil 0.3 0.5mm
This is a universal stencil for BGA reballing of mobile phone ics. Amaoe Universal Stencil is a high-quality stencil and choice of board-level repairing of mobile technicians.
This universal stencil is very popular among mobile repair engineers and saves a lot of money by its universal property.
- Brand New.
- Universal BGA Stencil 0.5 0.55 0.6 0.65 0.7 0.8 Space IC Reballing Pins Solder Tin Plant Amaoe Square Hole Heating Steel Mesh
- Deformation resistant material
- Precise pins location